China deploys first batch of HBM3E memory chips for AI
CXMT, a Chinese semiconductor company, begins to manufacture HBM3E (high bandwidth memory), the latest memory technology that powers AI accelerators. Although the production capacity is still low with only 25% yield, it marks the first step towards China’s self-reliance in memory chips.
A Chinese semiconductor company, ChangXin Memory Technologies (CXMT), has recently kicked off the manufacturing of HBM3E, the latest memory technology that powers AI accelerators. As reported by The Information, CXMT is still ramping up production — the wafer yield is about 25% in June. CXMT went public on the Shanghai Stock Exchange with an IPO of $8.6 billion.
The Gap With the Leaders Remains Wide
HBM4, the next-generation HBM, is already being mass produced by Samsung, SK Hynix, and Micron. CXMT lags one generation behind and won’t see any practical applications until 2027 when Alibaba T-Head and Cambricon begin to integrate CXMT’s chips into their AI accelerators.
Why This Matters for the Global AI Market
U.S. sanctions prevent China from accessing HBM produced by South Korea and the U.S., making it difficult for China to develop high-performance AI chips without high-bandwidth memory. With the production of HBM3E, even though it is at a low yield, China has gained some momentum towards its self-reliance in compute.
Source: the-decoder.com
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Author
Evgenii Arsentev
PhD · Chief Executive Officer, digital health
Articles · Latest articles